З 18.12.23 магазин в м.Дніпро за адресою вул.Новокримська 58 не працює.
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Solder paste is a mixture of solder powder and gel-like flux.
When heated, the powder fuses in a flux environment, forming a brazed joint.
ROL1 class flux gel, most suitable for refurbishment and small batch production.
Medium-temperature solder paste is optimal for critical soldering of SMD elements with a pitch of 0.3 mm.
Very good wettability.
It is also used for assembling double-sided printed circuit boards when soldering the first side of the board (the second is soldered with low-temperature paste).
Specifications:
Chemical composition of the solder alloy in percent:
Sn (tin) - 62%
Pb (lead) - 36%
Ag (silver) - 2%
Temperature range:
preheat: 90-150°C
reflow start: 178°C
soldering temperature: 190°C - 210°C
storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for applying to the board through a stencil.
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures between+5°C and+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.
Конечно, свежая. У нас несвежей не бывает. И хранится в холодильнике.
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
If you need additional information, or you found an error in the description, or have other questions about this product, then our manager will help you: Ярослав
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
