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| Code | photo_camera | Remains | shopping_cart | ||||||
|---|---|---|---|---|---|---|---|---|---|
| 041170 |  | Solder paste Sn62.8Pb36.8Ag0.4 Medium melting tin-lead solder paste with low-residue no-clean flux. Designed for reflow soldering of SMD elements. For production and repair. Contains silver. | total: 3 pcs маг ДП: 3 pcs |
| JUFENG |
