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High-quality double-sided development board, hole plating, high-quality mask printing.
Boards with metallization of vias have high routing ability, provide a high density of elements and good mechanical strength of their fastening. These boards allow mounting of elements on the surface and are the most common in the production of prototypes of radio-electronic devices.
Board dimensions: 90x70 mm;
Thickness: 1.6 mm;
Hole diameter: 1.1mm;
Hole pitch: 2.54 mm;
Distance between centers of mounting holes: 82x64 mm;
Diameter of mounting holes: 2 mm.
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