Solder paste is a mixture of solder powder and gel-like flux.
When heated, the powder fuses in a flux environment, forming a brazed joint.
ROL1 class flux gel, most suitable for refurbishment and small batch production.
Medium-temperature solder paste is optimal for critical soldering of SMD elements with a pitch of 0.3 mm.
Very good wettability.
It is also used for assembling double-sided printed circuit boards when soldering the first side of the board (the second is soldered with low-temperature paste).
Specifications:
Chemical composition of the solder alloy in percent:
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Sn (tin) - 62%
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Pb (lead) - 36%
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Ag (silver) - 2%
Temperature range:
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preheat: 90-150°C
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reflow start: 178°C
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soldering temperature: 190°C - 210°C
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storage temperature:+5°C to+15°C
The viscosity of the paste is optimal for applying to the board through a stencil.
Packing: medical syringe 5 ml (weight 25 grams).
Storage conditions: at temperatures between+5°C and+15°C, try to avoid direct sunlight.
Shelf life: 6-8 months, then the properties of the paste deteriorate.
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
