ЧП Ворон. Электронные компоненты и радиомонтажное оборудование. Микросхемы, транзисторы, реле, резисторы, конденсаторы, паяльное оборудование, припой.
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Whole catalog Materials for production and repairSoldering materials (solder, flux, braid)BGA reballing balls
 Tools and equipmentAll for mobile phone repairFlux, paste, balls for repairing mobile phones
Product code:
021318

BGA balls 0.70 mm (25 thousand pieces) tin-lead

BGA balls 0.70 mm in diameter. Packing 25 thousand pieces !!!
BGA balls 0.70 mm (25 thousand pieces) tin-lead
In stock
252,00 UAH × = 252,00 UAH
from 1 pc : 252,00 UAH
from 3 pcs : 244,40 UAH ( -3,0%)
from 10 pcs : 231,80 UAH ( -8,0%)

Current balances:

Магазин-Днепр
3 pcs
For Online Orders
3 pcs

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For reballing (pin recovery) of microcircuits in BGA packages.
Tin-lead, alloy composition Sn63Pb37.

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