Sheet glass fiber laminate, foil-clad with copper foil, grades MI-1222 (one-sided and double-sided foil, foil thickness 18; 35; 50; 70; 105 microns) is used in instrumentation, radio engineering, electronics for the manufacture of printed circuit boards.
It differs from SF grade fiberglass in a wider temperature range of application: from –60 С to+130С.
Allows mechanical processing.
Thickness 0.5-3.0 mm.
The time of resistance to the action of molten solder at t = 260 C is not less than 30 sec.
Peel strength in the initial state (per strip width of 3 mm) not less than 2.3N.
Attention! Glass fiber laminate with dimensions larger than A4 (300 x 200 mm), in order to avoid damage during transportation by transport agencies, at least 2 pieces of the same sheet size are sent (thickness and foiling may be different).
![Foil glass fiber laminate MI-1222-1-35 t.1,5 mm (610х510) [No. М53] one-sided](/files/pic/steklotekstolit/011210-s.jpg)
![Foil glass fiber laminate MI-1222-1-35 t.1,5 mm (610х510) [No. М53] one-sided](/files/pic/steklotekstolit/011210-b.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
