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Whole catalog Materials for production and repairSoldering materials (solder, flux, braid)Soldering paste
Код товару:
018632

Solder paste P818-633-90-J5 Qualitek 818 Sn63/Pb37 type 3, 90% ROL0 [500 g]

Medium melting tin-lead solder paste with no-clean flux. Designed for reflow soldering of SMD elements. For production and repair. Sn67Pb37 alloy. Bank of 500 grams.
 Solder paste P818-633-90-J5  Qualitek 818 Sn63/Pb37 type 3, 90% ROL0 [500 g]
NOT available.
Expected price: 2 520,00 UAH
from 1 pc : 2 520,00 UAH
from 3 pcs : 2 469,00 UAH ( -2,0%)
from 10 pcs : 2 419,00 UAH ( -4,0%)
Prices are indicated at the time of product availability and may change upon receipt

Current balances:

NOT available

Зображення товару

Product description format_size zoom_out zoom_in

818 is a lead-based solder paste containing halogen-free no-clean flux (J-STD-004 type ROL0). After the soldering process, a minimum amount of transparent, non-corrosive, non-conductive flux residues remains on the PCB compared to conventional solder pastes.
The properties of the chemical formula of this paste provide excellent activity, long-term retention of adhesive properties to hold components on the printed circuit board.
 
Advantages:
  • Minimal amount of flux residues after the soldering process
  • Excellent activity
  • Retention of adhesive properties up to 48 hours
  • Stencil life up to 24 hours
  • High print speed up to 150mm/sec
  • Headspace method can be used for reflow
Alloy - Sn63 / Pb37
Particle size: 25-45 microns
Metal content of the paste: 89% 
 
 
Physical/chemical properties
  • Color/Appearance - Metallic Gray
  • Copper Mirror Test (for the corrosiveness of the flux) - Passes without violations
  • Silver chromate test - Passes without discoloration
Surface insulation resistance Ohm

  ROL0
J-STD-004  
Bellcore  


   
pH- 5% Aqueous solution 3.0 – 5.0
Softening point 125°C
 

Viscosity

Malcolm Method 1 140-200 kilopulse/sec, 90% metal, ( -325+500 mesh)
Brookfield Method 2 900kp/s +/- 10%, 90% metal, (-325+500 mesh)
 

 
Malcom PCU-Series, 10 RPM, 25°C
Brookfield RVTD, TF spindle, 5 RPM, 25°C, 0.75” spindle depth
Bellcore GR-78-CORE

Recommended reflow profile of solder paste:


 
Delta Elite® is a registered trademark of Qualitek International.


Shelf life
Closed can 2°-10°C - 12 months (according to experience of use - up to 18 months).
25°C - 1 month.
Recommended storage temperature: 2°-10°C.


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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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