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Whole catalog Materials for production and repairHeat transfer materialsHeat-conducting substrates
Код товара:
024611

Thermally conductive substrate TM210 [200 * 400 * 0.5 mm]

Substrate for mounting radiators on fuel elements. Thickness 0.5mm. Dielectric.
 Thermally conductive substrate  TM210 [200 * 400 * 0.5 mm]
Expected price: 544,50 UAH
from 1 pc : 544,50 UAH
from 3 pcs : 528,00 UAH ( -3,0%)
from 10 pcs : 517,10 UAH ( -5,0%)
Prices are indicated at the time of product availability and may change upon receipt

Current balances:

NOT available

Изображение товара

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Used to improve heat transfer between heat-generating elements of electronic circuits (processors, power transistors, diodes, LED-crystals, processors, video chips) and a heatsink.
Plastic, after pressing, it gradually fills all microroughnesses, providing good thermal conductivity.
It is a dielectric. No additional measures are required to electrically isolate the component from the radiator, no need to install a mica gasket, etc.
Size: 200 x 400 mm
Thickness: 0.5mm

Specifications:
  • color: gray
  • thermal conductivity coefficient, not less: 3.2 W/(m·K)
  • operating temperature range: -60°C to +180°C
  • density: 2.28 ±0.2 g/cm³
  • hardness: (Shore): 20 ±5
  • elongation: 130% ±13%
  • tensile strength: 8 ±2 kg * f/cm²
  • dielectric strength:> 1.5 kV/mm
  • characteristic impedance:> 1017 Ohm * meter

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