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Whole catalog Materials for production and repairInsulation materialsInsulating pads and sleeves
Код товара:
028030

керамічна керамічна підкладка під Substrate TO-247 [0.635mm, 17x22mm] ceramic

For transistors in TO247 package. With fixing hole ∅3.6 mm.
 керамічна керамічна підкладка під Substrate TO-247 [0.635mm, 17x22mm] ceramic
Manufacturer: RICHONE
In stock
5,05 UAH × = 20,20 UAH
Issue rate: 4 pcs (The ordered amount will be automatically rounded to 4 pcs)
from 4 pcs : 5,05 UAH
from 20 pcs : 4,53 UAH ( -10,3%)
from 100 pcs : 4,02 UAH ( -20,4%)

Current balances:

Магазин-Днепр
9984 pcs
For Online Orders
9984 pcs

Product description format_size zoom_out zoom_in

Thermally conductive ceramic substrates are designed to transfer heat and electrical insulation of semiconductor devices to a cooling radiator.
Aluminum oxide substratesAl2O3They are many times superior to flexible silicone materials and mica in terms of thermal conductivity and provide the best operating conditions for components.

Attention! installation must be carried out using heat-conducting paste.

Dimensions:
  • length: 22 mm
  • width: 17mm
  • thickness: 0.635 mm
  • hole diameter: ∅3.6 mm
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.

If you need additional information, or you found an error in the description, or have other questions about this product, then our manager will help you: Ярослав slav.voron@gmail.com

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