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Whole catalog
↠ Materials for production and repair
↠ Heat transfer materials
↠ Heat-conducting substrates
Thermal pad PM150 [0.5 mm, 100x100mm] for processor Electrically insulating and thermally conductive silicone backing, with the addition of aluminum nitride. For mounting heat sinks on heat-generating electronic components. Thickness 0.5 mm, sheet 100 x 100 mm.
Expected price:
48,00
UAH
from 1 pc :
—
48,00
UAH
from 4 pcs :
—
45,60
UAH
( -5,0%)
from 10 pcs :
—
43,20
UAH
( -10,0%)
Prices are indicated at the time of product availability and may change upon receipt
Used to provide good heat transfer between the heat generating component (processor, microassembly, LED) and heatsink.
Also has dielectric properties, electrically isolating the heat sink from the component.
The silicone base gives the material high elasticity, the backing fills the microrelief of the mating surfaces well.
Aluminum nitride is used as a filler, which has excellent thermal conductivity.
Specifications:
thickness: 0.5 mm
sheet size: 100 x 100 mm
thermal conductivity: 1.5W/mK
dielectric constant: 4.5 kV/mm
operating temperature range: -50°C+200°C
linear elongation ratio: 1.48
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
If you need additional information, or you found an error in the description, or have other questions about this product, then our manager will help you: Ярослав
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