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Thermal pad PM150 [1 mm, 100x100mm] for 2SORT processor
Electrically insulating and thermally conductive silicone backing, with the addition of aluminum nitride. For mounting heat sinks on heat-generating electronic components. Thickness 1 mm, sheet 100 x 100 mm. Grade 2
Attention, discounted product!
The reason for the markdown is small sheet defects along the edge, no more than 10 mm deep into the sheet.
Used to ensure good heat transfer between the heat-generating component (processor, micro-assembly, LED ) and a radiator.
Also has dielectric properties, electrically isolating the heat sink from the component.
The silicone base gives the material high elasticity, the backing fills the microrelief of the mating surfaces well.
Aluminum nitride, which has excellent thermal conductivity, is used as a filler.
Specifications:
thickness: 1 mm
sheet size: 100 x 100 mm
thermal conductivity: 1.5W/mK
dielectric constant: 4.5 kV/mm
operating temperature range: -50°C+200°C
linear elongation ratio: 1.48
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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![Thermal pad PM150 [1 mm, 100x100mm] for 2SORT processor](/files/pic/pasta/032220-s.jpg)
![Thermal pad PM150 [1 mm, 100x100mm] for 2SORT processor](/files/pic/pasta/032220-b.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
