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Whole catalog Materials for production and repairSoldering materials (solder, flux, braid)BGA reballing balls
 Tools and equipmentAll for mobile phone repairFlux, paste, balls for repairing mobile phones
Product code:
026408

BGA balls 0.65 mm (5000 pcs) tin-lead

BGA balls with a diameter of 0.65 mm. Packing 5 thousand pieces.
BGA balls 0.65 mm (5000 pcs) tin-lead
In stock
63,00 UAH × = 63,00 UAH
from 1 pc : 63,00 UAH
from 3 pcs : 61,11 UAH ( -3,0%)
from 10 pcs : 59,22 UAH ( -6,0%)

Current balances:

Магазин-Днепр
41 pcs
For Online Orders
41 pcs

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For reballing (pin recovery) of microcircuits in BGA packages.
Tin-lead, alloy composition Sn63Pb37.

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