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Used to improve heat transfer between the heat-generating elements of electronic circuits (processors, power transistors, diodes) and the heat sink, as well as between the thermal sensor and the heat-generating element. It is a viscous, heat-resistant white mass.
It is not a dielectric, so a mica gasket must be installed if it is necessary to electrically isolate a component from the radiator.
Specifications:
color: white
operating temperature range: -30°C to +280°C
coefficient of thermal conductivity, not less: 0.925 W/(m K)
thermal resistance, no more: 0.225
maximum temperature range: -50°C to +300°C
density:> 2.0 g/cm³
viscosity: 1000
thixotropy: 380 ±10 1/10mm
Background information:
Thixotropy (thixotropy) - the ability of a substance to reduce its viscosity (liquefy) from mechanical action and increase its viscosity (thicken) at rest.
Thixotropy should not be confused with pseudoplasticity. For pseudoplastic fluids, viscosity decreases with increasing shear stress, while for thixotropic fluids, viscosity decreases over time at constant shear stress.
Source - Wikipedia
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
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![Heat-conducting paste TM400-TU30G [white, 30 g syringe]](/files/pic/pasta/021463-s.jpg)
![Heat-conducting paste TM400-TU30G [white, 30 g syringe]](/files/pic/pasta/021463-b.jpg)
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
