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KSM-386 -Two-component thermosetting solder mask, with good printing properties, fast curing after application with excellent adhesion, heat resistance, chemical resistance.
Applied through a stencil with a pattern
Baked at a temperature of 100 °C for 1 hour.
Thermal curing solder mask (KSM-386 series)
KSM-386 series for two-component heat curing solder mask, with good printability, fast curing, curing after coating with excellent adhesion, heat resistance and chemical resistance.
Ink features:
Items Head
Special properties
Preparation Notes
Yen color
Green color
Fine degree
≤ 8 m
0 ~ 25μm Fineness gauge
The mixing ratio
Main agent / curing agent = 23/2
Weight ratio
After mixing viscosity (25° C)
250 ± 50dPa · s
VT-04F
Mixed density (25 ° C)
1.20 ~1.40g/ Ml
Net Head
36 ~ 51T
Film thickness
18 ~ 22μm
Cured
Curing conditions
150 ° C, 30 to 60 minutes
Hot air circulation oven
You can use the time after mixing
24 hours
Less than25 ° CStore
Pencil Hardness
≥ 6H
Pencil Hardness Tester
Adhesion
100/100
Experimental hundred cells
Resistance soldering performance
288 ?, 10s , 3 times
No blistering off
IPC-SM-840D 3.7.3
Environmental standards
Comply with RoHS directive
SGS detection
Package installed
Main agent:920gHardener80g
Customers can choose according to demand
Main agent:4.6kgHardener0.4kg
Storage period
After the production date 6 months
Less than25 ° CDark storage
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
