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Used for the production of printed circuit boards, processing of parts by oxidation, in the process of copper plating, glass matting, nickel plating, etc.
Application:
1.Method. On the prepared (cleaned, skimmed) board n anosize a thin layer of mask through the stencil, creating protected and exposed areas of the board.
(Similar to silk screen printing).
We expose to the light of an ultraviolet lamp (LEDs, direct sunlight) until solidification.
2. Method.
Apply a mask in the form of one big drop (the volume is selected experimentally, the excess will flow out)
We cover with mylar film (the second detachable layer from the film photoresist), on top is a photomask, for example, printed on a printer.
Press down on top with glass, align the thickness of the mask, focusing on the color of the mask (the thicker - the darker).
We fix it so that the photomask does not move relative to the board, Expose it with ultraviolet light. We select the time experimentally, it depends on the thickness of the glass, the density of the photomask, the lamp power, the distance from the lamp to the board, temperature, etc.
Open areas will harden, darkened areas will remain in a pasty state, uncured mask is removed using a swab with isopropyl alcohol, nitro solvent, solvent, etc. After removing non-hardened areas, it is recommended to additionally "harden" the board - hold it for some time without protective films, stencils, directly in the rays of ultraviolet light.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
